Description
IMPACT-IAAC 2016
International Microsystems, Packaging, Assembly and Circuits Technology conference
3 topic of conference:
- Plenary speeches by Invensas, Prismark, Advantech, Univ. of Tokyo, Leveno
- Industrial session by ASE Group, Nan Ya Plastic Corp., SPIL Siliconware, Tong Hsieng Electronic Industries, Ltd.
- Special forum by ICEP Japan, Internet of Vehicle, IEEE Sip Roadmap, Iot&Wearable, Fanout Forum, IEC Embedded
- Organiser by IEEE, Imaps Taiwan, Industrial Technology Research Institute, TPCA
- Sponsor by ATOTECH, Board Tek Electronics Corp., Dow, Eternal, JSR Corp., SENTEC, TSMC, Unimicron
For more information, please refer to IMPACT 2016 webpage.
Cluster organisation