BalticNet-PlasmaTec together with the AdPack consortium will be present at the Interpack Fair in Germany

Submitted by Katherina Ulrich on 10 March 2017


Knowledge transfer is a key aspect for innovative and more globally competitive SME and therefore we would like to invite you and your cluster members to our 3rd Working Mission.

The aim of this Working Mission will be to foster cross-border collaboration, to start trust building and to strengthen networking. Our Working Mission will be held from the 9. – 11.05.2017 in Dusseldorf and Munich in Germany. On the 9th and 10th of May we will visit the Interpack fair. Interpack is the essential event for the food, beverage, confectionery, bakery, pharmaceutical, cosmetics, non-food and industrial goods sectors. No other trade fair in the world presents the entire supply chain. At no other trade fair does the packaging industry provide all sectors with tailored solutions and innovative designs based on such a variety of materials.

At the 11th of May we will visit the Fraunhofer Institute for Process Engineering and Packaging IVV. The Fraunhofer IVV stands for high-quality food products and safe, effective, and convenient packaging systems. Efficient use of raw materials and minimal environmental impact are priorities in all our development work. We transfer our technologies and expertise to applications outside the food and packaging industries. Companies and research organizations appreciate the Fraunhofer IVV as a business partner. People are inspired by our research work and the resulting products.

We would be very glad if you and/or your cluster members will join into these events. ku [at] (subject: AdPack%203rd%20Working%20Mission) (Please contact me) if you have any further questions.

Preliminary agenda for 3rd working mission in Germany

Cluster organisation
BalticNet-PlasmaTec e.V.
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